Journal: STAR Protocols

Article Title: Protocol on the fabrication of monocrystalline thin semiconductor via crack-assisted layer exfoliation technique for photoelectrochemical water-splitting

doi: 10.1016/j.xpro.2021.101015

Figure Lengend Snippet: Home-made electroplating zig (A) Disassembled home-made electroplating zig. The part at the center is used to fix the Si donor substrate which is used as a working electrode. The far right part shows a mesh-type Pt counter electrode. (B) The assembled electroplating zig consisting of all the parts from (A).

Article Snippet: Platinum counter electrode for Ni electrodeposition , neoscience , Catalog #: A-002250.

Techniques:

Journal: STAR Protocols

Article Title: Protocol on the fabrication of monocrystalline thin semiconductor via crack-assisted layer exfoliation technique for photoelectrochemical water-splitting

doi: 10.1016/j.xpro.2021.101015

Figure Lengend Snippet: Set-up for Ni stressor layer deposition on seed layer-coated Si donor substrate (A) Seed layer-coated Si donor substrate with teflon tape at the edges. (B) Set-up for Ni stressor layer deposition with home-made electroplating set-up and Pt counter electrode. The electric wires contacting Si donor substrate and Pt counter electrode are connected to working and counter electrode terminals of the potentiostat, respectively.

Article Snippet: Platinum counter electrode for Ni electrodeposition , neoscience , Catalog #: A-002250.

Techniques:

Journal: STAR Protocols

Article Title: Protocol on the fabrication of monocrystalline thin semiconductor via crack-assisted layer exfoliation technique for photoelectrochemical water-splitting

doi: 10.1016/j.xpro.2021.101015

Figure Lengend Snippet:

Article Snippet: Platinum counter electrode for Ni electrodeposition , neoscience , Catalog #: A-002250.

Techniques: Recombinant, Encapsulation, Software