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Journal: Micromachines
Article Title: Efficient Thermal-Stress Coupling Design of Chiplet-Based System with Coaxial TSV Array
doi: 10.3390/mi14081493
Figure Lengend Snippet: Critical indexes of CTSV array at the optimized parameters.
Article Snippet: In this research, the FEM model of a Chiplet-based system with a
Techniques: